-
340ROHM SemiconductorROHM’s EcoGaN™ has been adopted in the 45W Output USB-C Charger C4 Duo from Innergie, a brand of Delta
ROHM has announced the adoption of its 650V GaN device (EcoGaN™) in the C4 Duo, a 45W output USB-C charger from Innergie,...
-
356Electronics ComponentLittelfuse Introduces Ultra-Miniature Overmolded Reed Switch Solution for Space-Constrained Designs
59177 Series is ideal for security, metering, appliances, and portable battery-powered IoT applications Littelfuse, Inc. (NASDAQ: LFUS), an industrial technology manufacturing company...
-
403Top 10 NewsAdvanced Energy Highlights Ultra-High-Density Standard and Configurable Power Solutions at APEC 2024
Advanced Energy Industries, Inc. (Nasdaq: AEIS) – a global leader in highly engineered, precision power conversion, measurement and control solutions – will...
-
474MouserMouser Showcases Latest Offerings From HARTING for Industrial Networking, Factory Automation, and More
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is stocking the latest innovations from...
-
474Top 10 NewsPico Technology Unveils the PicoScope 6428E-D: A High-Performance Oscilloscope Optimized for Speed
Pico Technology, a leading provider of test and measurement equipment, introduces the PicoScope 6428E-D oscilloscope, a cutting-edge device designed for applications demanding...
-
405ArticleUltrasonic Testing Market Size Grow with a CAGR of ~10.1%
Research Nester’s recent market research analysis on “Ultrasonic Testing Market: Global Demand Analysis & Opportunity Outlook 2035” delivers a detailed competitor’s analysis...
-
552Farnell element14element14 speeds test time-to-market with availability of NI LabVIEW+ Suite
Timesaving, affordable software bundle from NI saves developers’ time and opens the door to those eager to implement their ideas element14 has...
-
587STMicroelectronicsSTMicroelectronics expands into 3D depth sensing with latest time-of-flight sensors
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced an all-in-one, direct Time-of-Flight (dToF) 3D...
-
556MicrochipMicrochip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify...
-
664Top 10 NewsAPPLIED VENTURES INVESTS IN VVDN TECHNOLOGIES
The investment signifies Applied Ventures’ commitment to foster innovation, collaboration, and entrepreneurship in the semiconductor and electronics manufacturing ecosystems. Applied Ventures, LLC,...
