- New pSLCN751Pi PCIe Gen4 NVMe M.2 2280 SSD Achieves Groundbreaking
- 150,000 P/E Cycle ConfigurationTargeted for Mission-Critical Applications
ATP Electronics, a global leader in specialized storage and memory solutions, proudly announces the launch of the N751Pi PCIe Gen4 NVMe M.2 2280 SSDs, which set a new industry standard withunmatched endurance among industrial solid state drives (SSDs) configured with pseudo single-level cell (pSLC) NAND.
The groundbreaking 150K P/E cycling configuration of NAND was achieved, thanks to a combination of ATP’s exceptional strengths — from the use of prime NAND package, stringent NAND integrated circuits (IC) characterization and 100% NAND screening and validation capabilities, to ATP’s own-developed firmware, specialized hardware configurations, and technologies.
Thanks to their exceptional endurance and ability to operate in extreme temperatures, the N751Pi SSDs are ideal for mission-critical and write-intensive applicationsin harsh environments, rugged conditions, and intense workloads.
Highest-Endurance Industrial SSD in the Market
Unmatched Endurance
The N751Pi SSD comes with a standard high endurance rating of 100K P/E cycles but can be further configured upon request to achieve an unparalleled endurance of 150K P/E cycles — a 50% increase. This enhancement translates to an impressive 75 Drive Writes Per Day (DWPD) for sequential write workloads and 21 DWPD for JESD219A enterprise workloads, all supported by a robust 5-year warranty.
Notes:
- The same WAI is applied to both P/E cycle scenarios.
- The calculations are based on a specific drive configuration (1.28 TB usable capacity).
- The drive has 7% overprovisioning, with the physical drive being 1.36 TB.
Superior Data Retention
With 100% P/E cycles, the N751Pi SSD can store data for up to a year at 55°C, outperforming other storage devices with similar P/E cycles. This superior data retention capability makes the N751Pi SSD an ideal choice for applications requiring long-term data preservation under challenging environmental conditions.
Thermally Engineered for Robust 125°C Cross-Temperature Operating Range
From IC selection/screening to firmware optimization and hardware configuration, our SSDs are thermally engineered at every level:
Industrial-Grade Prime Die:
Rigorous NAND IC screening ensures top-quality components for extreme conditions
Advanced Firmware Configuration
Thermal Throttling:
The SSD intelligently adjusts its workload to maintain maximum sustained performance and throughput while preventing overheating. This dynamic approach optimizes performance within safe temperature ranges.
Cross-Temperature Error Handling:
ATP has developed technology to mitigate errors that can occur when SSDs operate across varying temperatures. This is particularly important for scenarios where data is written at low temperatures (-40°C) but read at high temperatures (85°C), which can increase error rates and potentially compromise data integrity over time. ATP’s solution helps maintain data integrity even as the NAND approaches the end of its operational life.
Customizable Heatsinks
For better performance in harsh environments, ATP offers customizable heatsink options based on customer requests or joint validation results. Available options include 4mm, 8mm, and copper foil heatsinks.
Hardware-Based Power Loss Protection with MCU and PLP Circuitry
ATP adoption of microcontroller units (MCUs) in SSDs enhance reliability, performance, and adaptability by enabling advanced power management, data integrity protection, and real-time optimization of drive operations.
MCU in action: Input Power Noise De-glitch mechanism that accurately distinguishes between actual power loss events and temporary power instabilities. This prevents false triggers that could cause unnecessary cache flushes or SSD freezes due to misinterpreted power fluctuations.
Enhanced TLC Configuration Offering: N651Si/N651Sc
The N651Si/N651Sc Series provides an excellent middle ground for applications that require better-than-average TLC performance and endurance, but donot necessarily need the extreme endurance of pSLC.
This version outperforms other TLC offerings on the market and includes all the advanced features of the N751Pi Series, with capacities ranging from 240 GB to 3.84 TB.
Product Specifications
PCIe® Gen4 NVMe M.2 2280 SSD | ||||||||
Product Line | Premium | Superior | Value | |||||
N751Pi (150K P/E cycle configuration drive available on a project basis) |
N751Pi | N651Si / N651Sc | N601Sc | N601Vi / N601Vc | ||||
Interface | PCIe G4 x4 | |||||||
Flash Type | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC | 3D TLC | 3D TLC | |||
Form Factor | M.2 2280-D6-M1 | M.2 2280-D2-M | M.2 2280-D6-M1 | M.2 2280-D2-M | M.2 2280-D6-M1 | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280-S3-M |
Operating Temperature | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C / 0°C to 70°C | -40°C to 85°C / 0°C to 70°C | 0°C to 70°C | -40°C to 85°C / 0°C to 70°C | ||
Power Loss Protection Options | Hardware + Firmware Based | Firmware Based | Hardware + Firmware Based | Firmware Based | Hardware + Firmware Based | Firmware Based | Firmware Based | Firmware Based |
Optional SED Features | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption,
TCG Opal 2.0 |
AES 256-bit Encryption, TCG Opal 2.0 | ||||
Capacity | 80 GB to ˊˋ640 GB | 1.28 TB | 80 GB to ˊˋ640 GB | 1.28 TB | 240 GB to 1.92 TB | 240 GB to 3.84 TB | 240 GB to 1.92 TB | 240 GB to 1.92 TB |
Performance | ||||||||
Sequential Read (MB/s) up to | 6,450 | 6,450 | 6,450 | 6,450 | 6,450 | 6,450 | 6,450 | 5,000 |
Sequential Write (MB/s) up to | 6,050 | 6,100 | 6,050 | 6,100 | 6,050 | 6,050 | 6,050 | 4,300 |
Random Reads IOPS up to | 1,090,000 | 1,050,000 | 1,090,000 | 1,050,000 | 1,091,000 | 1,091,000 | 1,095,000 | 800,000 |
Random Writes IOPS up to | 1,107,000 | 1,200,000 | 1,107,000 | 1,200,000 | 1,245,000 | 1,245,000 | 1,244,000 | 1,100,000 |
Endurance and Reliability | ||||||||
Endurance (TBW)2 up to | 90,000 TB | 180,000 TB | 60,000 TB | 120,000 TB | 9,230 TB | 17,930 TB | 5,700 TB | 4,175 TB |
Reliability MTBF @ 25°C |
>2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours |
Others | ||||||||
Dimensions (mm) | 80.0 x 22.0 x 3.85 80.0 x 24.4 x 12.5 (with 8 mm heatsink) |
80.0 x 22.0 x 3.6 80.0 x 24.4 x 12.5 (with 8 mm heatsink) |
80.0 x 22.0 x 3.85 80.0 x 24.4 x 12.5 (with 8 mm heatsink) |
80.0 x 22.0 x 3.6 80.0 x 24.4 x 12.5 (with 8 mm heatsink) |
80.0 x 22.0 x 3.85 80.0 x 24.4 x 12.5 (with 8 mm heatsink) |
80.0 x 22.0 x 3.6 80.0 x 24.4 x 12.5 (with 8 mm heatsink) |
80.0 x 22.0 x 3.6 80.0 x 24.4 x 12.5 (with 8 mm heatsink) |
80.0 x 22.0 x 2.4 |
Certifications | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | ||
Warranty | 5 years | 5 years | 2 years | 2 years | 2 years | 2 years | ||
1. M.2 2280-D6-M form factor (max height: 3.85mm), offers Hardware-Based Power Loss Protection. M.2 2280-D2-M form factor (max height: 3.6mm), provides Firmware-Based Power Loss Protection. 2. Under highest Sequential write value. May vary by density, configuration and applications. |
For more information on the ATP N751Pi PCIe® Gen4 NVMe M.2 2280 SSD, visit:https://www.atpinc.com/products/industrial-gen4-nvme-M.2-ssd
Media Contact on the Press Release: Kelly Lin (Kellylin@tw.atpinc.com)
Follow ATP Electronics on LinkedIn: https://www.linkedin.com/company/atp-electronics