AUSTIN, Texas – another classification of chip has unfolded upon the semiconductor business as per Freescale. One stage past the recognizable framework on-chip (SoC), this new class named Single Chip System Module (SCM) incorporates everything a SoC contains, in addition to gigaBytes of DRAM stacked on top alongside a force administration chip and blaze memory chip nearby its double ARM Cortex-A9 application processors.
Thus, Freescale claims a 50% diminishment in board space and a 25% quicker to-market metric, in addition to the capacity to do prescient information examination with its first model of the new group of SCMs, the i.MX 6D.
“At this time the first model is for stopped in Internet of Things [IoT] and representation center points, however the entire family will be ventured into portables, wearables, self-ruling detecting hubs, and car applications soon,” said Nancy Fares, VP of framework arrangement items talking ahead of time of the Freescale Technology Form 2015 (FTF, held here June 22-25). “Truth be told, in our corner at FTF we will be indicating specimens of the cutting edge chip for versatile applications nearby the i.MX 6D.”
The Freescale i.MX 6D is known as a Single Chip System Module (SCM), instead of a framework on-chip (SoC) in light of the fact that it houses four pass on, including ARM Cortex-A9 duel centers (left), low-power twofold information rate (LPDDR2) memory-empowered force administration chip (upper right), 16 megaByte serial fringe interface (SPI) NOR streak nonvolatile memory (lower right) in addition to a staked 1-gigaByte Micron LP-DDR2 chip (not demonstrated).
(Source: Freescale)
The Freescale i.MX 6D is known as a Single Chip System Module (SCM), as opposed to a framework on-chip (SoC) in light of the fact that it houses four kick the bucket, including ARM Cortex-A9 duel centers (left), low-power twofold information rate (LPDDR2) memory-empowered force administration chip (upper right), 16 megaByte serial fringe interface (SPI) NOR streak nonvolatile memory (lower right) in addition to a staked 1-gigaByte Micron LP-DDR2 chip (not demonstrated).
(Source: Freescale)
As per Principal Analyst Jim McGregor, organizer of Tirias Research (Phoenix, Ariz.), this new class of processor will develop into an entire family that objectives higher-execution higher-power applications now, yet suspecting lower-force lower-end processors for compact and wearable markets with new models soon.
The IoT business is centered around coordination, so Freescale’s endeavor to place everything in the same bundle bodes well, McGregor said.
Freescale makes it all – processors, rationale, sensors and interconnects – yet utilizing distinctive procedures that can without much of a stretch be coordinated into the same bundle -which is better than average for applications like therapeutic. I would expect that this is going to drive other semiconductor creators to make get up to speed models going ahead.
McGregor predicts that Freescale will put RF modules- -WiFi and Bluetooth Low Power- -into future models of the i.MX 6 arrangement, and in addition trim the force for littler wearables, since the present model expends around three-to-five Watts.
The Freescale i.MX 6D in its bundle, so you can perceive how they Micron 1-gigaByte low-power twofold information rate (LP-DDR2) chip is stacked on the Freescale multi-bite the dust chip holding the double ARM Cortex-A9 centers, power administration chip and 16 megaByte serial fringe interface (SPI) NOR streak nonvolatile memory.
(Source: Freescale)
The Freescale i.MX 6D in its bundle, so you can perceive how they Micron 1-gigaByte low-power twofold information rate (LP-DDR2) chip is stacked on the Freescale multi-kick the bucket chip holding the double ARM Cortex-A9 centers, power administration chip and 16 megaByte serial fringe interface (SPI) NOR streak nonvolatile memory.
(Source: Freescale)
“The current i.MX 6D is suitable for AC controlled gadgets like family sensor centers, or portables with enormous batteries like tablets, IoT rambles or bigger wearables like virtual reality glasses,” McGregor said. “Be that as it may, conceivably, Freescale could challenge Apple in coordination by placing everything in the same bundle for low-control gadgets as well -like smartwatches and wellness gadgets.”
Freescale as of now calls the i.MX 6D the “world’s littlest SCM” at just 14-by-17-by-1.7 millimeters- -including the gigaByte of Micron DDR2 on the bundle, the three kick the bucket for processor, power administrator and blaze in addition to discrete segments that mean a terrific aggregate of 109 parts in one bundle -which, Freescale cases would somehow or another should be mounted on a 6-inch printed circuit board (PCB)- -however rather are all inside a solitary bundle the extent of a dime. Freescale is interconnecting every one of these parts utilizing an exclusive innovation that Fares would not depict, but to say “its not an interposer.”
The Freescale i.MX 6D assessment load up (accessible from Arrow Electronics) contains the i.MX 6D chip itself in addition to all the typical peripherals and interfaces in addition to Freescale’s free firmware and programming administrations for smooth combination into its environment of accomplices -shortening gadget outline time to six months, as per Freescale.
(Source: Freescale)
The Freescale i.MX 6D assessment load up (accessible from Arrow Electronics) contains the i.MX 6D chip itself in addition to all the standard peripherals and interfaces in addition to Freescale’s free firmware and programming administrations for smooth joining into its biological system of accomplices -shortening gadget outline time to six months, as per Freescale.
(Source: Freescale)
The SCM likewise has equipment, firmware, and programming security elements, including irregular number era, cryptographic figure motors, and carefully designed and fake insurance, all inherent and configurable by the broad improvement framework made only for the i.MX 6D. Charges likewise underscored that the blaze is sufficiently enormous to hold an entire Linux or Android working framework (OS), which could likewise be stacked into the DRAM at the command of the architect.
The SCM i.MX 6D is slated for conveyance in August 2015 alongside its advancement framework and assessment board preloaded with either Linux or Android from Arrow Electronics, with whatever is left of the family slated for discharge over the course of the following two years.
imageEi
June 24, 2015 at 8:18 pm
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imageEi
tramiEi
June 24, 2015 at 9:17 pm
Sie haben ins Schwarze getroffen. Mir scheint es der ausgezeichnete Gedanke. Ich bin mit Ihnen einverstanden.
tramiEi