Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the world leader in automotive semiconductor solutions, and VinFast, Vietnam’s first global smart electric car maker, announced to extend their partnership on occasion of Infineon’s OktoberTech™ Asia Pacific 2022 Technology Forum in Singapore. The two companies will set up a joint application competence center focusing on electromobility to accelerate VinFast’s development of solutions for the future of smart mobility. The inauguration of the center is planned in the first quarter of 2023.
Infineon and VinFast extend partnership in the field of electromobility. Mdm. Thuy Le, Global CEO of VinFast (fifth from left) and Mr. Kenneth Lim, Head of Automotive, Asia Pacific at Infineon (sixth from left) signed the Memorandum of Understanding (MoU) in Hanoi on 22 September 2022 as the prelude to the announcement made on occasion of OktoberTech™ Asia Pacific.
The creation of the VinFast–Infineon Competence Center (VICC) signals a new level in the relationship between both companies, who will jointly engage in the early development phase of VinFast’s next-generation smart mobility solutions and will also discuss future semiconductor requirements to achieve supply chain stability. VICC will initially focus on the development of a new electric drive train (EDT) for VinFast electrified platforms. This is a part of VinFast’s strategy to connect intelligence globally and to ensure its competitive advantages in the global EV market.
“VinFast’s goal is to create smart mobility solutions for a sustainable future,” said Mdm. Le Thi Thu Thuy, Vice Chairwoman of Vingroup and Global CEO of VinFast. “We are thrilled to extend our partnership with Infineon – the leader in semiconductors for electromobility. Infineon’s advanced products and solutions will help to enhance VinFast’s production efficiencies and support us reach our goals faster.”
Based on its system understanding as well as broad product and technology portfolio Infineon will provide technical support and guidance on semiconductor selection including conventional technologies and those based on WBG (Wide Bandgap) semiconductor materials, including silicon carbide (SiC). The competence center will house a laboratory with testing and measuring equipment to provide prompt product validation.
“The growth of electromobility is undisputed,” said Peter Schaefer, Executive Vice President and CMO of the Automotive division at Infineon. Market research expects every second newly produced car to be fully or partially electrified in five years’ time. “Infineon is committed to driving this progress together with partners like VinFast that demonstrate high execution speed and strong determination. We will assist VinFast’s electrification journey and support the advancement of their electric platform designs.”
VinFast and Infineon have been working closely for more than three years prior to this newly extended agreement. Many of Infineon’s solutions have been utilized in VinFast’s vehicles, such as inverter for the electric motor and high-voltage on-board charger (OBC) and DC-DC for ePowertrain, as well as in E/E (electrical and electronic) architectures.
Infineon is at the core of the transformation of the automotive industry towards sustainable mobility. Further information on Infineon’s mobility offering is available at www.infineon.com/mobility
Infineon is the global number one in the 2021 automotive semiconductor market with an overall market share of 12.7 percent, and an outstanding share of 31.7 percent in the automotive power semiconductor market (Strategy Analytics: Automotive Semiconductor Vendor Market Shares. March 2022).
