YXLON International,a company that designs and produces radioscopic and CT inspection systems for a broad variety of industrial applications, is pleased to announce that it has been awarded a 2019 Global Technology Award in the category of Inspection – X-ray for its YXLON FF70 CL highest resolution advanced 2D and 3D X-ray system. The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.
The new YXLON FF70 CL X-ray inspection system has been specifically developed to enable the very best automated analysis of the smallest and most demanding features within these samples. The result: impressively precise and reproducible test and inspection excellence. Semiconductor manufacturing requires automated, high-quality, reliable, fast and non-destructive inspection and analysis for optimum production as flaws can be found on the wafer, on a substrate, in a strip in the sub-assembly or in the final device.
The YXLON FF70 CL is distinguished by its large inspection area of 510 x 610mm and the extreme detail volume detectability of < 0,3 µm³, making it ideal for automatically and non-destructively analyzing solder bumps and filled vias in 3D ICs, flip chips and wafers.

The FF70 CL provides 2D (top-down) with a high-performance flat-panel and 3D (CL-Computed Laminography) automated analysis using a high-resolution Image Intensifier within a special manipulation assembly for its inclined rotations.

Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

For more information, visit www.yxlon.com.