FinFast™-based Crescendo vertical power platform displaces existing power delivery approaches to enable higher performance computing with industry-leading power density, speed and unmatched efficiency

Empower Semiconductor, the world leader in integrated voltage regulators (IVRs), today unveiled the Crescendo vertical power delivery platform to address the growing power demands of artificial intelligence (AI) and high-performance computing (HPC) applications. Featuring Empower’s proprietary FinFast™ technology, the Crescendo platform unlocks scalable on-demand true vertical power delivery for upwards of 3,000A power domains, offering an unprecedented combination of system efficiency, current density and nanoseconds transient response.

As modern data center work loads increasingly demand more power and speed, existing power delivery architectures are no longer viable. To deliver high efficiency, traditional lateral power solutions operate slowly, creating a large footprint of bulky power stages and magnetics on the topside of the printed circuit board (PCB).The slow speeds also require large capacitor banks in the shadow of the processor, occupying the most power-sensitive real estate in the system and resulting in substantial lateral transmission power losses. The exponentially rising transmission losses due to the power increase of new AI chips create a critical impasse for the industry.

Crescendo eliminates the capacitor bank and energy storage requirements by providing energy on demand to the AI chip at unprecedented speed and accuracy. With the capacitors eliminated, Crescendo’s high-density and ultra thin thermally enhanced package fit in the critical area under the processor to deliver high efficiency, vertically coupled power to the AI chip and eliminate the prohibitive lateral transmission loss.

The FinFast™ technology operates with benchmark efficiency at blazing speeds utilizing cutting-edge silicon combined with novel control architectures, high-frequency magnetics, wide-bandwidth capacitors and best-in-class power packaging. The co-design of these innovative technologies enables the full integration of all power supply components in the world’s most dense and efficient AI power delivery solution.

Key benefits of the Crescendo platform include:

• Ultrafast Bandwidth:With 20x higher bandwidth than traditional power converter, the FinFast™

powered Crescendo platform essentially eliminates PCB-mounted high-frequency decoupling capacitors and relocates the active power delivery directly below the processor.

• Power Density: The Crescendo platform provides 5x higher total solution density for the same level of power delivery, enabling truly vertical power deliveryin 1mm or 2mm of height.
• Efficiency:Crescendo enables over 10% reduction in power delivery losses from traditional power delivery architectures. For a typical data center with 100,000 CPU instances, this results in a greater than 8-megawatt (MW) reduction in power loss.

Empower Semiconductor will be demonstrating the Crescendo platform for the first time at the 2024 OCP Global Summit, Booth #C61, taking place October15-17, 2024, in San Jose, Calif.To learn more visitwww.empowersemi.com.