The world’s leading PCB and EA show takes up an extra hall.Many new exhibitors join established market leaders at the show
The 2019 International Electronics Circuit Exhibition (Shenzhen) – formerly the International Printed Circuit & APEX South China Fair – will be held from 4-6 December 2019. In addition to Halls 1, 2 and 4 of the Shenzhen Convention & Exhibition Center in Shenzhen, China, this year’s Show will take up Hall 9 and part of Hall 3, bringing the total exhibition area to over a gigantic 67,500 sq.m. and making this edition the largest ever, with close to 3,500 booths at the show floor.
The additional Hall 9 will accommodate more PCB equipment suppliers, giving visitors to this hall the opportunity to see a wider range of equipment innovations from over 100 exhibitors including Machvision, TKK, Top Goodwill, Micronic, Abletek, Leader, ALTIX, Shenzhen Sunshine, ORC, Daidalos, Takisawa, Huaheng Intelligent, Enge CNC, Asia Neo, KraftPowercon, Kontec, Dongguan Strong, Mengxing, and many more.
Comprehensive Coverage of Evolving Market Trends
The global 5G Market is forecast to grow exponentially between 2018 and 2025 . This rapid development will underpin increasing connectivity for a range of other smart technologies such as the Internet of Things (IoT), artificial intelligence (A.I.), Big Data, cloud computing, and self-driving cars, creating many business opportunities in the PCB industry. As one of the most influential PCB & EA trade shows, the Show covers all aspects of the industry, making it the ideal place for participants to explore the latest innovations in order to grow their business.
Of the 600 exhibitors this year, 112 are new and they are coming from Mainland China, Hong Kong, Taiwan, Korea, Japan, France, Sweden, and Germany. New exhibitors bringing their offerings to the Show include both innovative startups and established names, including Lauffer, Leica, Seven Ocean, GIS, Mass-Laminate Circuit, Tengtong, Beyond, Zhiwei, Disking, Jiexun, Traco World, Sungsan Hitech, Enpas, V Technology, Asahi-Denzai, Baling, Flex, and many more.
Industry Experts Address the Latest Hot Topics at International Technical Conference
Among the many additional attractions at the Show, the 3-day International Technical Conference will invite respected industry experts to share their insights into the latest trends and technological innovations. This year’s keynote speaker is Mr. Liu Zhe, Chief Engineer, Institute of Manufacturing Engineering, ZTE Corporation, who will speak on the topic “5G high frequency brings challenges and needs to PCB industry”. Another well-known industry expert, Other strong speaker line-up including Dr. Hayao Nakahara, President, N.T. Information, Dr. Shiuk-Kao Chiang, Managing Partner, Prismark and Mr. Lin Ting Hao, Senior Project Director, Advanced Product Development of Advanced Technology Center, Kinsus Interconnect Technology Corp.
Pre-register Now to Enjoy Multiple Privileges*
Online and WeChat pre-registration systems are now available, for both individuals and groups. Advance registration entitles visitors to a range of privileges, including a FREE Shenzhen metro/bus ticket to get more out of your visit, and a chance to win the hottest electronic gadget onsite. Group pre-registration of 4 people or above entitles the group leader to receive an additional gift onsite. Free shuttle bus service will be provided to groups of 30 or more people within the same company located in Guangdong Province.*
Don’t miss the opportunity to participate and get inspired at the largest-ever HKPCA Show – the region’s premier showcase for the PCB and EA industry – a one-stop sourcing platform for the latest products, services and solutions under one roof spanning the whole supply chain, supplemented by a selection of accompanying events to enhance visitors’ experience and provide valuable networking opportunities. Pre-register now!
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